Description

Chemical composition: Thiophenate methyl tech. ( Based on 94% w/w a.i) 74.46% , Precipitated silica 17.54% w/w, sticking agent (glue) 2.00% w/w, suspending agent (CMC) 2.00% w/w, wetting agent( alkyl aryl suphonate ) ( Idet- 10) 2.00% w/w, dispersing agent( alkyl napthyl sulphonate ) Tamol DN 2.00% w/w. Total: 100.00% w/w